Photochemically Curing Resist for Thermal Nanoimprint Lithography series
▣ Excellent film quality▣ Tg 40°C (before curing)
▣ Imprinting, UV flood exposure, annealing and mould release i at the same temperature
▣ Smallest feature size at least 50 nm(depending on mould resolution)
▣ Very low residual layer thickness < 10 nm
▣ Excellent pattern transfer fidelity
▣ Plasma etch resistance comparable to conventional novolak-based photoresists
등록된 상품이 없습니다.