KMSF 1000​

Polyimide-based Dielectric Photoresist​

▷​ Material Attributes​​

· Negative tone, photoimageable dielectric

· No warpage due to low shrinkage and tensile modulus

· I-Line/broadband sensitivity, 1:1 aspect ratio imaging

· Low temperature processing (< 200°C)

· Good electrical properties

· High thermal and chemical stability

· Low moisture uptake

   KMSF 2000

Low Dk/Df Photo-Dielectric​

▷​ Material Attributes

​· Negative tone, photoimageable dielectric

· 5 to 10 µm film thickness after cure

· I-Line/broadband sensitivity, 1:1 aspect ratio imaging

· Low temperature cure ≤ 200°C

· Low Dk/Df electrical properties

· Low moisture uptake

· Good thermal and chemical stability

​ 

▷ Material Uses​

· RDL dielectric

· Passivation and protective layer

· Wafer level packaging