Wafer Bonding Adhesive Negative Epoxy Dry Film

▷ Material Attributes​

· Antimony-Free

· Low Halogen

· Aqueous TMAH developed​

· Negative-tone patternable dry-film adhesive for permanent wafer bonding

· Excellent adhesion to silicon and glass​

· Low process temperature, full cure at 180ºC​

· Fast void-free bondi​ng (150ºC, 10.2kN)

· Patterned using broadband or i-line exposure tools​

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▷ Material Uses

· fabrication of chemically and thermally stable structures

· cavity walls for sensor packaging, and lids for microfluidic devices​​