제품 기본설명
Chemically Amplified Negative Photoresist series
제품 상세설명
▣ Excellent adhesion to metals
▣ Aqueous developer compatible（2.38% TMAH)▣ Wet strips in conventional strippers
▣ Greater than 100 µm film thickness in a single coat
▣ High aspect ratio with near vertical sidewalls
▣ Excellent plating resistance
▣ High chemical and plasma resistance
▣ Excellent dry etch resistance
KMPR, SU-8 제거 가능
- Microwave Plasma로 기판에 데미지 없이 PR 제거 가능.
관련제품
등록된 상품이 없습니다.
