Resists for Bi-layer Lift-off Processing

▷ Material Attributes​

· Won’t intermix when over-coated with imaging resists

· High thermal stability: Tg ~190°C

· Removes quickly and cleanly in conventional resist strippers

· Enables sub 0.25µm micron bi-layer resist imaging

· Enables high yield, very thick (>3µm) metal lift-off processing

▷ Material Uses​

· Metal lift-off processing

· Airbridge fabrication

· Release layers

▷ Product Range