Negative Photore​sists

For Direct Laser Writing (DLW) @ 405 nm & Two Photon Polymerization (2PP)​

▷ Material Attributes

· Specifically designed for exposure wavelengths above 400 nm

· Suitable for DLW (e.g. @ 405 nm) & 2PP

· High sensitivity

· Excellent thermal and chemical stability

· High wet and dry etch stability

▷ Material Uses

· Fast and contactless prototyping by DLW & 2PP

· Etch mask for wet and dry etch processes

· Mould for electroplating

· Mould for stamp fabrication by thermal or UV moulding

· Optical applications in micro systems technology​

※ Compatible Developer: mr-Dev 600