photo-curable NIL resist

for applying hard and non-permeable stamp materials

▷ Material Attributes

· No need for additional adhesion promoter or primer proved on different substrates

 (Si, SiO2, Al, sapphire, Cu, different underlayer materials like LOR, UL1, UL3)

· Can be cured under ambient conditions in the presence of air

· Low viscosity renders fast cavitity filling and minimize propensity for air bubble defects​