photo-curable NIL resist

for soft-NIL using soft stamp materials, e.g. PDMS.​

▷​ Material Attributes​​

· Excellent curing properties, even under air (presence of oxygen)

· Compatibility to PDMS working stamps for soft-NIL

· Outstanding dry etch stability against various substrates like silicon, quartz, or aluminum

· Purely organic resist, residue-free removable with oxygen plasma possible after curing​

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▷ Material Uses​​​

· Etch mask for pattern transfer processes (dry and wet etching)

· Fabrication of nanostructures for LEDs, photonic crystals

                                        Patterned sapphire substrates (PSS)

                                        Microelectronics

                                        Organic electronics (OLED, OPV, OTFT)

                                        Data storage (bit patterned media)

                                        Lift-off applications in combination with e.g. LOR (KAM, USA)