photo-curable NIL resist, solvent-free​

▷​ Material Attributes

· high content of fluorinated components for easy stamp release and low defectivity

· 100% organic, easy strippable with oxygen plasma

· Can be diluted to 100nm film thickness using PGMEA or ma-T 1050

· Low refractive index of cured material (RI = 1.40)

▷ Material Uses

· ​NIL applications where comparably low release forces are essential (e.g. imprints on top of a multilayer stack)