​Negative Photoresists for Electrolytic Plating

​▷ Material Attributes​

· Negative tone, chemically amplified resist

· ​7 to 20 µm film thickness in a single coat

· ​i-Line/broadband sensitivity, 2:1 achievable aspect ratio

· ​No rehydration or latency delay

· ​Aqueous alkaline development (standard 0.26N TMAH)

· ​Excellent resistance to copper plating chemistries

· ​Residue-free removal

▷ Material Uses​​​​

· Electroplating

· ​RDL