제품 상세설명
Low Temperature, Photoimageable Wafer Bonding Adhesives
▷ Material Attributes
· Negative tone, photo-imageable adhesives
· Alkaline and solvent developable series
· High resolution patterning
· Low temperature processing (< 200°C)
· High quality, void-free bonding
· Superb adhesion to silicon and glass
· Good process compatibility (dicing, soldering) and high reliability (HAST, TCT)
▷ General Bonding Process Flow
관련제품
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